Home > COOLTECH > Innovative technology
 |
 |
| |
 |
The new generation of COOLTECH solid state
relays draws upon the latest technological
advances made by Crouzet.
The COOLTECH’s superior capabilities are
the result of several technological advances : |
|
|
|
 |
Epoxy-free design |
| The epoxy-free design of the COOLTECH SSR eliminates the stress placed on internal
components due to the expansion and
contraction of epoxy during normal use.
Moreover, this eliminates the possibility of a
catastrophic failure as a result of severe stress
in the encapsulant during load failure |
|
|
|
Enhanced substrate quality |
The DBC substrate, along with the unique
vertical placement of the substrate, allows
the SCR die to efficiently transfer heat to the
heat sink and into ambient air (40% more
efficient than traditional substrate designs).
As a result, the SCR die operate at a lower
temperature than competitive relays. It also
accounts for the COOLTECH’s higher I2T and
surge-current ratings. |
|
|
|
Optimum surface area &
thermal management |
Three innovations promote efficiency :
 Larger SCR die with a lower Vf reduces
power dissipation and increases the
surface area necessary for heat transfer.
A reduction of solder joints in the path
of load-current improves reliability and
reduces overall dissipation.
An improved thermal interface material
reduces voids between the substrate and
the heat sink. |
COOLTECH
Advantage
Innovative technology
